1.We offer pure metals , compounds and alloys. 我們提供純金屬、化合物和合金材料.

2.Have circular, rectangular and any special design. 提供圓形、矩形和任何特殊形狀.

3.Offer special composition and producing method as customer’s requirement. 配合客戶對靶材有特殊成分及製程方式的需求.

 

Sputtering target

我們供應各種高純真空鍍膜之靶材,包含貴金、純金屬、合金、化合物等。我們真對研究單位常用的2”、3”及4”圓靶,備有多種現貨,可以迅速交貨。我們的靶來自各國,我們基於誠信經營的原則,我們會誠實告知,也提供COA。我們的產品如不符您的需求,無條件接受退貨,絕不推諉。

我們提供背板及黏合的服務,您的靶材,我們負完全責任。

Backing plate

無論是無氧銅、鋁、或鈦背板,皆可按您的要求,精準製作
Oxygen free, high conductivity (OFHC) copper is a common backing plate material. It has good electrical and thermal characteristics, is easy to machine and is readily available at economic prices

Types of bonds

Indium metal – The most common target bond utilizes pure Indium
metal as the bonding agent.

Silver epoxy – The silver filled epoxy bonding cements are high
quality products. They contain over 90% of high purity silver for
optimum thermal and electrical conductivity.

Material Metal、Compound、Alloy(wt%)
Purity 99.5% ~ 99.9999%
Size 2”、 3”、 4”、 6”
Thickness 3mm、6mm
Cu plate bonding Yes No
Keeper Yes No